Flex and rigid flex PCBs

    Thanks to their versatility, flexible and rigid flexible PCBs are becoming increasingly popular and are used anywhere where the greatest possible performance needs to be fitted into the smallest possible space. Our services open up a wide range of different material and property combinations and virtually unlimited design and structure options, from prototypes through to series production.

    Our flexible and rigid flexible PCBs, which are produced individually to your requirements for installation bending or permanent bending exposure, are a top quality product. Whether it is for connecting moving parts or simply because of a lack of space, flexible and rigid flexible PCBs could be an ideal solution for your application.

    Features
    Capabilities
    Materials

    Polyester, Polyimide, FR4 (also High Tg), Kapton

    Layers

    1 to 4 layers (Flex Board)
    2 – 12 layers (Rigid-Flex Board)

    Stiffener Materials

    PI, PET, FR4, SUS

    Overall thickness

    12.5 µm to 50 µm for Flex
    0.1mm – 3.2mm for Rigid-Flex
    12 µm to 25 µm for Cover layer
    12 µm to 35 µm for Adhesive tape

    Base copper thickness

    18, 35, 70 µm RA Copper
    12, 18, 35 µm ED Copper

    Finished thickness

    min 0.071mm/ 0.0028’’ (Single sided)
    min. 0.096mm/ 0.0038’’ (Double sided)
    min. 0.305mm/ 0.012’’ (4Layers)

    max. panel size

    250 x 500mm/ 9.842’’ x 19.685’’

    Blind or Buried Vias

    Yes, for Flex-Rigid boards

    Track width + space

    2/2mil (50 / 50 µm)

    min. Bonding Pitch

    0.1mm/ 0.004’’ (Center to Center

    min. SMT Pitch

    0.40mm / 0.016’’ (Center to Center)

    Surfaces

    Hot air leveling, (Lead or Lead-free)
    Bondgold for ultrasonic bonding
    Bondgold for thermalsonic bonding
    Hardgold for Connectors
    immersion Tin
    chem. Au /Ni (immersion gold over nickel)
    Silver ink or Carbon ink
    OSP (Entek)

    Soldermask

    Flexible, photoimageable Soldermask or Coverlayer

    Outline

    CNC-Routing
    Precision Punching
    Laser cutting

    Hole sizes

    min. Outline tolerances routed
    min. Outline tolerances punched
    min. Holesize diameter
    min. Hole position tolerance
    min. Pattern Registration tolerance
    min. Soldermask Registration tolerance

    + /-0.075mm
    + /-0.050mm
    + /-0.050mm
    + /-0.050mm
    + /-0.050mm
    + /-0.050mm

    General Capabilities

    min. Annular ring
    min. Soldermask bridge
    plated Gold thickness
    immersion gold thickness
    Twist and Wrap
    E / Test Voltag
    Continuity
    Flying Probe test available

    0.025mm
    0.100mm
    0.025 µm – 3 µm
    0.025 µm – 0.1 µm
    < 1%
    24V – 300V
    5 – 100Ohms

    Product description (PDF)