One-sided PCBs

    One-sided copper-clad base material is suitable for producing simple, cost-effective PCBs. Various material solutions allow optimised production processes, the result is unbeatable value for money. In the large-volume sector, the bright CEM1 base material is an excellent compromise:

    It is cost-effective and offers good punchability (contours and bores) and provides a good value solution for your circuits.

    FR4 fulfils the strictest requirements: Minimum bore holes to 0.3 mm, contours can be milled or punched and the fact that various material thicknesses (from 0.4 mm to 3.2 mm) are available give a wide range of applications in the industrial sector.

    Features
    Capabilities
    Layers

    1 Layer

    Laminate

    FR4, High Tg FR4, Halogen free FR4, CEM1 (paper-glass composite material) FR2
    (Paper phenolic)

    Thickness

    0.4 to 6.8mm

    Copper thickness

    12 / 18 / 35 / 70 / 105 µm

    Approval

    UL-approval, Flame class 94V-0

    Specialized laminate

    Taconic, Rogers, Neltec, Arlon, further specialized material

    max. Boardsize

    max. 610 x 730mm

    Surface finish

    Hot air leveling, (Lead or Lead-free)
    Bondgold for ultrasonic bonding
    Bondgold for thermalsonic bonding
    Hardgold for Connectors
    immersion Tin
    chem. Au/Ni (immersion gold over nickel)
    Silver ink or Carbon ink
    OSP (Entek)

    Soldermask

    Liquid, photoimageable Soldermask, in green or as requested
    Peelable Mask

    Component marking

    White or per request

    Outlines

    CNC-Routing
    CNC V-Scoring
    CNC Milling
    Precision Punching

    min. Drill Diameter

    0.2mm / 0.008”

    General tolerances

    min. Outline tolerances routed
    min. Outline tolerances punched
    min. Holesize diameter
    min. Hole position tolerance
    min. Pattern Registration tolerance
    min. Soldermask Registration tolerance

    +/-0.100mm
    +/-0.075mm
    +/-0.050mm
    +/-0.050mm
    +/-0.050mm
    +/-0.050mm

    General Capabilities

    min. Annular ring
    min. Soldermask bridge
    plated Gold thickness
    immersion gold thickness
    Twist and Wrap
    E/Test Voltage
    Continuity
    Flying Probe test available

    0.050mm
    0.100mm
    0.025 µm – 3 µm
    0.025 µm – 0.6 µm
    < 1%
    24V – 300V
    5 – 100Ohms

    Product Description (PDF)

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