HDI PCBs

    Thinner, smaller, lighter and more functions: This is the aim when developing and designing new components. The increased packing densities of components such as BGAs demand new layout structures. Based on laser via technology or controlled mechanical depth drilling, the connections to the inner layers can be produced based on staggered or stacked technology.

    The latest production technologies in sterile areas and a team of top-qualified specialists in all production technologies are the basis for your customised HDI PCB.

    The aim of every product development is a reliable solution which is tailored to the area of application, customised and perfect in terms of design and functionality.

    Features
    Capabilities
    Layers

    1+N+1 up to max. 4+N+4

    Laminate

    FR4, High Tg FR4, Halogen free FR4, G10, BT, P97, PTFE

    Thickness

    0.2 to 4.2mm

    Copper thickness

    12 / 18 / 35 / 70µm

    Approval

    UL-approval, Flame class 94V-0

    Specialized laminate

    Taconic, Rogers, Neltec, Arlon, further specialized material

    max. Boardsize

    max. 640 x 540mm

    Surface finish

    Hot air leveling, (Lead or Lead-free)
    Bondgold for ultrasonic bonding
    Bondgold for thermalsonic bonding
    Hardgold for Connectors
    immersion Tin
    chem. Au /Ni (immersion gold over nickel)
    Silver ink or Carbon ink
    OSP (Entek)

    Soldermask

    Liquid, photoimageable Soldermask, in green or as requested
    Peelable Mask

    Component marking

    White or per request

    Outlines

    CNC-Routing
    CNC V-Scoring
    CNC Milling
    Laser Milling

    min. Via Diameter

    75µm (Laser), 100µm (Mechanical)

    General tolerances

    min. Outline tolerances routed
    min. Holesize diameter
    min. Hole position tolerance
    min. Pattern Registration tolerance
    min. Soldermask Registration tolerance

    +/-0.075mm
    +/-0.050mm
    +/-0.050mm
    +/-0.050mm
    +/-0.050mm

    General Capabilities

    min. Annular ring
    min. Soldermask bridge
    plated Gold thickness
    immersion gold thickness
    Twist and Wrap
    E/Test Voltage
    Continuity
    Flying Probe test available
    Capped vias

    0.025mm
    0.050mm
    0.025µm – 3µm
    0.025µm – 0.6µm
    < 1%
    24V – 300V
    5 – 100Ohms

    Product description (PDF)